The US Commerce Department said late on Friday it will limit the size of government subsidizes for semiconductor manufacturing and will not let firms use funding to “pad their bottom line.” On Thursday, the US House of Representatives gave final approval to legislation that provides $52b in government funding to boost semiconductor manufacturing and research. President Joe Biden is expected to sign the legislation early next week. The Commerce Department Friday told chips companies awards will be “no larger than is necessary to ensure the project happens here in the United States” and added it will discourage “race-to-the-bottom subsidy competitions between states and localities.”